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X-REFLOW 306 LF-AC Full convection, bench top, superior batch reflow oven. For Sale

X-REFLOW 306 LF-AC Full convection, bench top, superior batch reflow oven.
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X-REFLOW 306 LF-AC Full convection, bench top, superior batch reflow oven. :
$2000.00

Full convection heating with independent control of the front and rear heaters enables accurate temperature and time settings in 5 zones and presetting of various profiles for different PCB’s. There is an additional purging zone added for operation in Nitrogen environment.

  • A large inspection window allows for monitoring the soldering process during operation (inspection can be done using a microscope or a camera system).

  • Closed-loop monitoring guarantees absolute repeatability of the temperature profiles.

  • A large backlit display shows either the specific temperatures/times or a real-time graph of temperature versus time

  • The oven is Nitrogen-ready and can be used for soldering in a nitrogen environment without any additional hardware. N2 environment operation decreases the oxidation of leads and pads during soldering. A compressed N2 gas source can be used to replace air (oxygen).

  • The oven implements a computer interface for downloading firmware upgrades from a PC via
    the X485-USB Converter. It will allow the future use of our Windows-based PC Control Program to operate the oven from a PC.

  • Minimum operating temperature set at 50°C allows soldering of PCBs using low temperature solders or curing conductive adhesives and other materials that require lower temperatures.

  • Two external thermocouple inputs located on the back panel in conjunction with the optional X-306 Oven Monitor program allow the operator to monitor (see in real-time on a PC, save and print) the board temperature through-out an entire reflow process.

  • X-Reflow306 oven can operate at higher than other ovens max. temperature of 350 °C (662 °F) and has better, stronger materials to assure good performance when soldering with lead free alloys.

  • Desk Top Size. It has a small foot print and weighs only 53kg. Conventional ovens are large in size, but
    the X-Reflow306 LF-AC can fit on top of a desk in a small room. If mobility is needed, a dedicated ESD-safe cart for the oven is offered (ATR-1/306). A fume extraction system is also offered.

  • Storage Capacity for up to 250 programs
    The five zone operation processes- Preheat 1, Preheat 2, Soak, Reflow and Cooling are called a Program. Each zone has a defined temperature and time in which to reach and maintain the temperature. Up to 250 of such programs can be stored in the unit’s memory and recalled when needed.
    Each Program can be specific to a PCB size, construction (number of layers), and type of solder paste used for the process.


  • Well thought-out

  • Designed for prototyping, laboratory testing,
    heat-resistance testing and low volume production.

  • Large backlit LCD displays the setting of temperature and time of the operation, it can show the numerical value or a graph.

  • Optional X-306 Oven Monitor program allows viewing, record or printing of actual temperature graphs

This oven was designed to achieve the highest degree of process control possible for demanding applications that call for uniform temperature distribution, temperature stability, accelerated cooling and repeatability.


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