Amdahl 470 CPU Gold Chip MCC.
TheAmdahl 470 Mainframe was introduced in 1975 . TheAmdahl 470 delivered compatibility and competition to the IBM 370.Dr. Gene Amdahl (RIP) was an IBM Fellow and principal designer ofIBM's 360 Mainframe.
When IBM declined his idea to air coolprocessors and improve performance he started his own company.
UsingECL (Emitter Coupled Logic) Technology Amdahl bonded a gold platedcooling tower on top of the chip to allow heat dissipation withoutthe need for water cooling and chillers.
Dr. Amdahl's designsignificantly lowered operating cost and ran 2x faster than the IBM370.
This MCC (multi-chip carrier) is approximately 7.5 x 7.5 incheswith 42 chip positions.
Each chip has a gold plated cooling towerwith gold circuitry on the chip.
The underside of the board containsan array of thin wires communicating signals between the chips.
Thisis all visible when you take the MCC out of the lucite shippingcontainer.
Serial number# C630-5150-T101 7Y173
These chip assemblies were manufactured at Amdahl's HQ inSunnyvale CA.